SMT Finger Structure
Alink product line > SMT Finger
Structure
In the past, most of designer use EMI gasket for EMI solution and grounding function, now Alink develop SMT finger instead of traditional metal finger and EMI gasket,not only its tiny size but its automatic SMT process will let production quickly and smoothly.
The dimension of SMT finger is more flexible for engineer design and it is certainly satisfied to all of our client
product, especially who need thin and light weight requirement.
Most of SMT finger has Au electroplated outside and Ni electroplated inner which has ability of standing bad
circumstance like high humidity and temperature.
Electroplated (outside)
- Au electroplated
- Tin electroplated
- Customer assigned
- Au plated (outside) : can resist bad circumstance and good electric conductivity.
- Tin plated (outside) : good solidarity,but easy to oxidize in air ,especially in high humidity.
Electroplated (inner)
- Ni plated (inner) :
- withstand high humidity and protect from oxidization.
- good adhesion force between electroplated layer.
- withstand high friction.
- Ni plated (inner) :
- withstand high humidity and protect from oxidization.
- good adhesion force between electroplated layer.
- withstand high friction.
Raw material
- Beryllium Copper
- Stainless Steel
- TiCu
- Phosphor Bronze
- Customer assigned
- beryllium copper is the most popular material in many circumstance :
- Good thermal conductivity
- Good electric conductivity
- Easy forming
Electroplated (outside)
- Au electroplated
- Tin electroplated
- Customer assigned
- Au plated (outside) : can resist bad circumstance and good electric conductivity.
- Tin plated (outside) : good solidarity,but easy to oxidize in air ,especially in high humidity.
Electroplated (inner)
- Ni electroplated
- Ni plated (inner) :
- withstand high humidity and protect from oxidization.
- good adhesion force between electroplated layer.
- withstand high friction.
Raw material
- Beryllium Copper
- Stainless Steel
- TiCu
- Phosphor Bronze
- Customer assigned
- beryllium copper is the most popular material in many circumstance :
- Good thermal conductivity
- Good electric conductivity
- Easy forming
